台灣芝浦先進科技股份有限公司

半導體生產設備 Semiconductor Manufacturing Equipment  Japanese    English

   ●   WET CLEANING / ETCH EQUIPMENT FOR WAFER AND PHOTOMASK

   ●   ETCHING / ASHING EQUIPMENT FOR WAFER AND PHOTOMASK

   ●   FOUP INSPECTION EQUIPMENT

   ●   HIGH SPEED HIGH ACCURACY EPOXY DIE BONDER

   ●   TSV / COW FLIP CHIP BONDER

   ●   µLED & MINI LED CHIP BONDER / MOLDING / TILING EQUIPMENT